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Springer Verlag, Singapore
Springer-Verlag New York
Van Nostrand Reinhold Inc.,U.S.
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Showing 9 of 9 Results in All Departments
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Semiconductor Advanced Packaging (Hardcover, 1st ed. 2021)
John H. Lau
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4,432
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Fan-Out Wafer-Level Packaging (Hardcover, 1st ed. 2018)
John H. Lau
R
3,752
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Solder Joint Reliability - Theory and Applications (Hardcover, 1991 ed.)
John H. Lau
R
5,960
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Chip On Board - Technology for Multichip Modules (Hardcover, 1994 ed.)
John H. Lau
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5,915
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Handbook Of Tape Automated Bonding (Hardcover, 1992 ed.)
John H. Lau
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5,974
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Mechanics of Solder Alloy Interconnects (Hardcover, 1994 ed.)
Darrel R. Frear
,
Steven N. Burchett
,
Harold S. Morgan
,
John H. Lau
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5,838
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Heterogeneous Integrations (Hardcover, 1st ed. 2019)
John H. Lau
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4,089
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Semiconductor Advanced Packaging (Paperback, 1st ed. 2021)
John H. Lau
R
3,185
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Solder Joint Reliability - Theory and Applications (Paperback, Softcover reprint of the original 1st ed. 1991)
John H. Lau
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5,683
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