Big Data Analyses, Services, and Smart Data (Paperback, 1st ed. 2021)


This book covers topics like big data analyses, services, and smart data. It contains (i) invited papers, (ii) selected papers from the Sixth International Conference on Big Data Applications and Services (BigDAS 2018), as well as (iii) extended papers from the Sixth IEEE International Conference on Big Data and Smart Computing (IEEE BigComp 2019). The aim of BigDAS is to present innovative results, encourage academic and industrial interaction, and promote collaborative research in the field of big data worldwide. BigDAS 2018 was held in Zhengzhou, China, on August 19-22, 2018, and organized by the Korea Big Data Service Society and TusStar. The goal of IEEE BigComp, initiated by Korean Institute of Information Scientists and Engineers (KIISE), is to provide an international forum for exchanging ideas and information on current studies, challenges, research results, system developments, and practical experiences in the emerging fields of big data and smart computing. IEEE BigComp 2019 was held in Kyoto, Japan, on February 27-March 02, 2019, and co-sponsored by IEEE and KIISE.

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Product Description

This book covers topics like big data analyses, services, and smart data. It contains (i) invited papers, (ii) selected papers from the Sixth International Conference on Big Data Applications and Services (BigDAS 2018), as well as (iii) extended papers from the Sixth IEEE International Conference on Big Data and Smart Computing (IEEE BigComp 2019). The aim of BigDAS is to present innovative results, encourage academic and industrial interaction, and promote collaborative research in the field of big data worldwide. BigDAS 2018 was held in Zhengzhou, China, on August 19-22, 2018, and organized by the Korea Big Data Service Society and TusStar. The goal of IEEE BigComp, initiated by Korean Institute of Information Scientists and Engineers (KIISE), is to provide an international forum for exchanging ideas and information on current studies, challenges, research results, system developments, and practical experiences in the emerging fields of big data and smart computing. IEEE BigComp 2019 was held in Kyoto, Japan, on February 27-March 02, 2019, and co-sponsored by IEEE and KIISE.

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Product Details

General

Imprint

Springer Verlag, Singapore

Country of origin

Singapore

Series

Advances in Intelligent Systems and Computing, 899

Release date

September 2021

Availability

Expected to ship within 10 - 15 working days

First published

2021

Editors

, ,

Dimensions

235 x 155mm (L x W)

Format

Paperback

Pages

117

Edition

1st ed. 2021

ISBN-13

978-981-15-8733-7

Barcode

9789811587337

Categories

LSN

981-15-8733-7



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