Modeling Self-Heating Effects in Nanoscale Devices (Hardcover)

, , ,
It is generally acknowledged that modeling and simulation are preferred alternatives to trial and error approaches to semiconductor fabrication in the present environment, where the cost of process runs and associated mask sets is increasing exponentially with successive technology nodes. Hence, accurate physical device simulation tools are essential to accurately predict device and circuit performance. Accurate thermal modelling and the design of microelectronic devices and thin film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient heat removal methods are necessary to increase device performance and device reliability. The authors provide readers with a combination of nanoscale experimental techniques and accurate modelling methods that must be employed in order to determine a device's temperature profile.

R3,209

Or split into 4x interest-free payments of 25% on orders over R50
Learn more

Discovery Miles32090
Mobicred@R301pm x 12* Mobicred Info
Free Delivery
Delivery AdviceShips in 10 - 15 working days


Toggle WishListAdd to wish list
Review this Item

Product Description

It is generally acknowledged that modeling and simulation are preferred alternatives to trial and error approaches to semiconductor fabrication in the present environment, where the cost of process runs and associated mask sets is increasing exponentially with successive technology nodes. Hence, accurate physical device simulation tools are essential to accurately predict device and circuit performance. Accurate thermal modelling and the design of microelectronic devices and thin film structures at the micro- and nanoscales poses a challenge to electrical engineers who are less familiar with the basic concepts and ideas in sub-continuum heat transport. This book aims to bridge that gap. Efficient heat removal methods are necessary to increase device performance and device reliability. The authors provide readers with a combination of nanoscale experimental techniques and accurate modelling methods that must be employed in order to determine a device's temperature profile.

Customer Reviews

No reviews or ratings yet - be the first to create one!

Product Details

General

Imprint

Morgan & Claypool Publishers

Country of origin

United States

Series

IOP Concise Physics

Release date

September 2017

Availability

Expected to ship within 10 - 15 working days

Authors

, , ,

Format

Hardcover

Pages

107

ISBN-13

978-1-64327-808-7

Barcode

9781643278087

Categories

LSN

1-64327-808-8



Trending On Loot