Packaging of High Power Semiconductor Lasers (Hardcover, 2015 ed.)
Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui LiuThis book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
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Product Description
This book introduces high power semiconductor laser packaging design. The challenges of the design and various packaging and testing techniques are detailed by the authors. New technologies and current applications are described in detail.
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Product Details
General
Imprint | Springer-Verlag New York |
Country of origin | United States |
Series | Micro- and Opto-Electronic Materials, Structures, and Systems |
Release date | July 2014 |
Availability | Expected to ship within 12 - 17 working days |
First published | 2015 |
Authors | Xingsheng Liu, Wei Zhao, Lingling Xiong, Hui Liu |
Dimensions | 235 x 155 x 22mm (L x W x T) |
Format | Hardcover |
Pages | 402 |
Edition | 2015 ed. |
ISBN-13 | 978-1-4614-9262-7 |
Barcode | 9781461492627 |
Categories | |
LSN | 1-4614-9262-9 |
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