Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.
The book also includes exercises and detailed solutions at the end of each chapter.
Or split into 4x interest-free payments of 25% on orders over R50
Learn more
Reliability of Microtechnology discusses the reliability of microtechnology products from the bottom up, beginning with devices and extending to systems. The book's focus includes but is not limited to reliability issues of interconnects, the methodology of reliability concepts and general failure mechanisms. Specific failure modes in solder and conductive adhesives are discussed at great length. Coverage of accelerated testing, component and system level reliability, and reliability design for manufacturability are also described in detail.
The book also includes exercises and detailed solutions at the end of each chapter.
Imprint | Springer-Verlag New York |
Country of origin | United States |
Release date | February 2011 |
Availability | Expected to ship within 12 - 17 working days |
First published | 2010 |
Authors | Johan Liu, Olli Salmela, Jussi Sarkka, James E. Morris, Per-Erik Tegehall, Cristina Andersson |
Dimensions | 235 x 155 x 19mm (L x W x T) |
Format | Hardcover |
Pages | 204 |
Edition | 2011 ed. |
ISBN-13 | 978-1-4419-5759-7 |
Barcode | 9781441957597 |
Categories | |
LSN | 1-4419-5759-6 |