Reliability, Yield, and Stress Burn-In - A Unified Approach for Microelectronics Systems Manufacturing & Software Development (Paperback, Softcover reprint of the original 1st ed. 1998)

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The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: * the economic impact of employing the microelectronics fabricated by in dustry, * a study of the relationship between reliability and yield, * the progression toward miniaturization and higher reliability, and * the correctness and complexity of new system designs, which include a very significant portion of software.

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Product Description

The international market is very competitive for high-tech manufacturers to day. Achieving competitive quality and reliability for products requires leader ship from the top, good management practices, effective and efficient operation and maintenance systems, and use of appropriate up-to-date engineering de sign tools and methods. Furthermore, manufacturing yield and reliability are interrelated. Manufacturing yield depends on the number of defects found dur ing both the manufacturing process and the warranty period, which in turn determines the reliability. the production of microelectronics has evolved into Since the early 1970's, one of the world's largest manufacturing industries. As a result, an important agenda is the study of reliability issues in fabricating microelectronic products and consequently the systems that employ these products, particularly, the new generation of microelectronics. Such an agenda should include: * the economic impact of employing the microelectronics fabricated by in dustry, * a study of the relationship between reliability and yield, * the progression toward miniaturization and higher reliability, and * the correctness and complexity of new system designs, which include a very significant portion of software.

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Product Details

General

Imprint

Springer-Verlag New York

Country of origin

United States

Release date

August 2014

Availability

Expected to ship within 10 - 15 working days

First published

1998

Authors

, ,

Dimensions

235 x 155 x 22mm (L x W x T)

Format

Paperback

Pages

394

Edition

Softcover reprint of the original 1st ed. 1998

ISBN-13

978-1-4613-7596-8

Barcode

9781461375968

Categories

LSN

1-4613-7596-7



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