Low Dielectric Constant Materials for IC Applications (Hardcover, 2003 ed.)


Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

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Product Description

Low dielectric constant materials are an important component of microelectronic devices. This comprehensive book covers the latest low-dielectric-constant (low-k) materials technology, thin film materials characterization, integration and reliability for back-end interconnects and packaging applications in microelectronics. Highly informative contributions from leading academic and industrial laboratories provide comprehensive information about materials technologies for < 0.18 um process technology. Topics include: Organic dielectric materials, Inorganic dielectric materials, Composite dielectric materials, Metrology and characterization techniques, Integration, Reliability. This volume will be an invaluable resource for professionals, scientists, researchers and graduate students involved in dielectric technology development, materials science, polymer science, and semiconductor devices and processing.

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Product Details

General

Imprint

Springer-Verlag

Country of origin

Germany

Series

Springer Series in Advanced Microelectronics, 9

Release date

November 2002

Availability

Expected to ship within 12 - 17 working days

First published

2003

Editors

, ,

Dimensions

235 x 155 x 19mm (L x W x T)

Format

Hardcover

Pages

310

Edition

2003 ed.

ISBN-13

978-3-540-67819-9

Barcode

9783540678199

Categories

LSN

3-540-67819-0



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